JUne 2017

Feature Article

 

Using Thermal Simulation to Design a Better Outdoor Electronic Product

Nitesh Kumar Sardana, Thermal Management of Electronics Group
Robert Bosch Engineering and Business Solution Pvt. Ltd.

 

Electronic products operate in varied thermal environments. Their operation is challenged when the size of the housing is reduced and when the product is mounted in an open environment exposed to climatic conditions. Solar radiation increases the temperature difference of the product’s internal air from the ambient by 150 to 300 percent.

 

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  Sponsored Announcement

The Advancements in Thermal Management Conference has announced its final program. The event will feature sessions from industry leaders such as: Intel, DuPont, Colorado State University, Microchip Technology Corp., University of Denver, Outlast Technologies, TA Instruments, Schoeller Electronics Systems GmbH, AT&S Austria and others.

 

Click Here to View the Final Program

  New Products
 

Ultra-Thin Magnetic Sheets with High Permeability

TDK Corp. has expanded its Flexield family of noise suppression sheets with an ultra-thin copper-clad laminated sheet with high magnetic permeability. The new IFM10M magnetic sheets are 60 percent thinner than existing sheets with a magnetic layer of the same thickness, but offer an equivalent noise suppression performance over a broad frequency range from 500 kHz to 10 GHz. - read more

 

Polycase Introduces Line of NEMA Steel Enclosures

Polycase has introduced a line of NEMA-rated steel enclosures. Manufactured to meet demanding environmental conditions, the corrosion-resistant SB series steel enclosures protect industrial equipment against circulating dust, falling dirt, rain, and hose directed water. - read more

 

Lord Corp. Makes Micro-Mounts Technology Available to Electronics Components Industry

Lord Corp.has announced the availability of small high-performance vibration isolators for electronic components and PCB assemblies. Lord Micro-Mounts, which were originally developed for demanding aerospace as well as oil and gas applications, are now available to any OEM that needs to protect electronic components in harsh environments. - read more

 

Vertiv UPS Reduces Footprint and Increases Power Density for Large Data Center Customers

Vertiv has introduced the high-efficiency Liebert EXL S1, a large-scale uninterruptible power supply (UPS) system with a significantly smaller physical footprint and the industry’s highest power density. The Liebert EXL S1 enables customers to optimize data center design space and allows for the deployment of additional revenue-generating equipment. - read more

 

Zymet UA-2605-B Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP

Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP.  The work has been performed and published in the Proceedings of the SMTA International 2016 conference, “Reworkable Edgebond Applied Wafer-Level Chip-Scale Package (WLCSP) Thermal Cycling Performance Enhancement at Elevated Temperature” in a collaborative effort between Portland State University, Cisco, and Zymet. - read more

  Industry News
 

PDI Forms Partnership with Greensource Cincinnati

Power Distribution, Inc. (PDI) has formed a partnership with greensource Cincinnati. The new alliance underscores PDI’s commitment to Ohio and Kentucky-based mission-critical facilities by aligning the industry’s most innovative power distribution solutions with the regions’ most notable organization that provides the Midwest building community with energy efficient, sustainable technologies. - read more

 

UL-Certification for Ventec’s IMS Products Extended to Alternative Copper-Base Options

Ventec International Group has announced that UL-certification has been extended for the IMS-range of products to cover the addition of alternative copper-base options. - read more

 

EcoCortec Launches European VpCI Plastics Recycling Project

EcoCortec is implementing a European wide initiative to collect and recycle used VpCI films and bags. This is the first recycling program of this type implemented in Europe. Within the “Plastic Recycling Project” EcoCortec’s customers will send their waste material back to Croatian plant which will then be completely recycled and used for manufacturing a new product. - read more

 

TT Electronics Expands Representation Network in Canada

TT Electronics has announced that with immediate effect, Xtronics Inc., a top tier representative firm for manufacturers based in Canada, will lead market and customer development initiatives for TT Electronics in the region. - read more

 

Event Listings

REGISTER TODAY FOR THE 2017 IEEE EMC+SIPI SYMPOSIUM

EMC+SIPI 2017 Symposium is the leading international event where you can share your insights, exchange ideas, ask questions and learn from other EMC & SIPI experts. Experience the 5 days of technical workshops and tutorials, special sessions, technical papers, panel discussions and 200+ booth Exhibit Hall in Washington DC, on August 7-11, 2017.

New for 2017! EMC+SIPI 2017 Online Symposium is the IEEE EMC Society’s first online conference and will be broadcast live from, and co-hosted with, the traditional symposium. EMC+SIPI 2017 Online is FREE to all 5-day Paid On-Site Technical Attendees.

 

1 EVENT 2 WAYS TO ATTEND. Register now to take advantage of early discounts!


 

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