may 2017

Feature Article


Adiabatic Technology Helps Cooling Keep Pace with Data Center Growth

Adam Meyer, Sales Manager
Technical Systems, Inc.


Every year, the amount of electronic data that companies process and store grows exponentially. Data centers cannot economically increase the physical space available to keep pace with the growth, and are now challenged to provide more computer power in the same amount of space. The higher levels of microprocessing power in the same physical footprint increases heat density, so owners need more efficient cooling systems that will keep up with the market need without breaking the bank. One technology receiving attention is adiabatic cooling, which uses up to 90 percent less water than other systems.


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  Sponsored Announcement

The Advancements in Thermal Management Conference has announced its final program. The event will feature sessions from industry leaders such as: Intel, DuPont, Colorado State University, Microchip Technology Corp., University of Denver, Outlast Technologies, TA Instruments, Schoeller Electronics Systems GmbH, AT&S Austria and others.


Click Here to View the Final Program

  New Products

Premier Magnetics Drum Cores for EMI Filtering and Switch Mode Power Supplies

Premier Magnetics has introduced its new line of low-cost, high-performance drum core inductors designed for EMI filtering and switch mode power supply applications. With a product offering of over two dozen models with inductance values from 100 to 10,000 µH, the new PM-R series boasts low dc resistance (DCR), providing low temperature rise at high peak currents.  - read more


CamdenBoss Launches Active DIN Rail Enclosures

CamdenBoss has launched an innovative range of DIN Rail enclosures enabling quick and easy contact with a powered “active” track within the DIN Rail. Multiple enclosures from the company’s CNMB, CDIB and CVB-Plus ranges can be used in conjunction with the new active power track, connecting via specially developed 5mm pitch terminal blocks.  - read more


Take the Pressure off and Reduce Enclosure Condensation

Hammond Manufacturing offers three versions of breather kits for use with indoor and outdoor electrical enclosures. The Large Breather, the Small Rainproof Ventilator and the Pressure Compensation Plug designs protect the internally mounted equipment from contamination when fitted. - read more


GlacialTech Announces Igloo FR210 Series Cold Forging Heatsinks

GlacialTech has release a series heatsinks using cold forging technology that are well suited for lighting application from 100 W to 200 W. The Igloo FR210 series heatsink expands three models of 21cm diameter with different heights: Igloo FR210B (100 W), Igloo FR210C (150 W) and Igloo FR210D (200 W). - read more

  Industry News

How Supercapacitors will Compete with Batteries: Supercapacitor Materials 2017-2027

Supercapacitor Materials 2017-2027 is a drill down from the IDTechEx overview, Supercapacitor Technologies and Markets 2016-2026. It is packed with detailed analysis, many new infograms, conference slides, roadmaps and a ten year forecasts 2017-2027. - read more


Graphene: Market Update and Future Prospects

IDTechX has recently returned from the Graphene 2017 conference in Barcelona where I gave an invited talk. There is tremendous scientific progress, both on CVD and platelet type graphene, and across many graphene applications. Interestingly, the participants however repeatedly suggested that the industry has now passed the peak of hype and is well into the disillusionment period. - read more


Liquid Encapsulation Market – Forecasts from 2017 to 2022

The liquid encapsulation market is expected to grow at a compound annual growth rate of 6.10 percent over the period 2017 to 2022. Liquid encapsulation is a process by which a material such as a polymer is applied on devices for their protection. Rapidly expanding electronics market, growing trend towards miniaturization of devices, increasing investment from the public and private firms are some of the key factors contributing to the growth of this market. - read more


RLE Technologies Acquires Triad Floors from NxGen

RLE Technologies formally has acquired NxGen of Triad Floors, a prominent manufacturer of data center floor tiles and effective airflow solutions. The transaction was approved by the Boards of Directors of both companies on April 10, 2017. - read more


Event Listings

Register Today for the 61st ECTC !

IEEE’s 67th Electronic Components and Technology Conference (ECTC), will be held at the Walt Disney World Swan & Dolphin Resort, Lake Buena Vista, Florida, from May 30 to June 2, 2017. This premier international annual conference, sponsored by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society, brings together key stakeholders of the global microelectronic packaging industry, such as semiconductor companies, foundry and OSAT service providers, equipment manufacturers, material suppliers, research institutions and universities, all under one roof. The ECTC will offer 18 professional development courses and over 300 papers in 41 technical sessions. Authors from nearly 20 countries will cover a wide spectrum of topics, including advanced packaging, hheterogeneous integration, materials and processes, manufacturing, optoelectronics, reliability, electronic components, and simulation.

Go to for more information


EMC+SIPI 2017 Symposium is the leading international event where you can share your insights, exchange ideas, ask questions and learn from other EMC & SIPI experts. Experience the 5 days of technical workshops and tutorials, special sessions, technical papers, panel discussions and 200+ booth Exhibit Hall in Washington DC, on August 7-11, 2017.

New for 2017! EMC+SIPI 2017 Online Symposium is the IEEE EMC Society’s first online conference and will be broadcast live from, and co-hosted with, the traditional symposium. EMC+SIPI 2017 Online is FREE to all 5-day Paid On-Site Technical Attendees.


1 EVENT 2 WAYS TO ATTEND. Register now to take advantage of early discounts!


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